path: root/drivers/usb/musb/ux500_dma.c
diff options
authorFelipe Balbi <balbi@ti.com>2013-02-06 09:24:55 +0200
committerFelipe Balbi <balbi@ti.com>2013-03-18 11:17:06 +0200
commit787f5627bec80094db487bfcb401e9744f181aed (patch)
tree9352b4e9fa484e2899975f81984740ea8665948d /drivers/usb/musb/ux500_dma.c
parent99b7856f3cec5db7ec71a8b4675a63e4bcadd63e (diff)
usb: musb: make davinci and da8xx glues depend on BROKEN
those two glues are still including <mach/> headers and no active developement has been going on those glues for quite some time. Apparently, for da8xx glue, only initial commit 3ee076de (usb: musb: introduce DA8xx/OMAP-L1x glue layer) has been tested. All other patches seem to have been compile-tested only. For davinci glue layer, last real commit dates back from 2010, with commit f405387 (USB: MUSB: fix kernel WARNING/oops when unloading module in OTG mode). Signed-off-by: Felipe Balbi <balbi@ti.com>
Diffstat (limited to 'drivers/usb/musb/ux500_dma.c')
0 files changed, 0 insertions, 0 deletions

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